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Grinding and Polishing Machine - List of Manufacturers, Suppliers, Companies and Products

Grinding and Polishing Machine Product List

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Double-sided grinding/polishing machine ADG-1500

Double-sided grinding/polishing machine ADG-1500

Dual-side grinding machine for parallel plane honing and fine grinding.

This is a double-sided grinding machine with a unique mechanism developed for new projects. It uses two grinding wheels on the top and bottom, allowing multiple workpieces to be processed simultaneously on both sides, significantly reducing grinding time. It is 5 to 10 times faster than a lapping machine. It accommodates various fields such as carbide tools, automotive parts, hydraulic components, ceramic seals, aluminum computer arms, mold components, copper tan heat sinks, vane pump parts, hydraulic equipment, and valve plates for compressors.

  • Repair Agent

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Automatic Programming NC Centering Grinding and Polishing Equipment

Automatic Programming NC Centering Grinding and Polishing Equipment

Even beginners in lens processing can feel at ease. No mistakes with automatic initial settings.

The "Automatic Programming NC Centering Grinding and Polishing Device" is a polishing machine that can automatically set processing conditions just by inputting lens information. It features a lineup including the cup wheel smoothing machine "QCN-CS type," the smoothing machine "QCN-S type," and the polishing machine "QCN-P type." Additionally, it allows for customization tailored to specific purposes by combining the "base device" and "processing modes." 【Features】 ■ High precision and high reproducibility ■ Initial setting automatic programming function ■ Standardization of lens processing = completion of skill-less operation ■ Conditions can be changed according to preferences ■ Processing conditions are automatically set just by inputting lens information *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines

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Fully Automatic Wafer Grinding and Polishing Equipment 'CMG-802XJ'

Fully Automatic Wafer Grinding and Polishing Equipment 'CMG-802XJ'

It performs chuck surface cleaning, rough grinding, finishing grinding, and polishing fully automatically with one machine!

The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that places four vacuum chucks on a sorting table and processes in sequence: chuck surface cleaning, rough grinding, finishing grinding, and polishing, using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands for a wide variety of IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it provides a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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